Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC
assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.
Capabilities overview:
| Capabilities overview: | |
| | |
| Layers: | Rigid PCB 2 - 24 + Layers, Rigid-flex PCB 1 - 10Layers |
| Panel Size(max): | 21" x 24" |
| PCB Thickness: | 0.016" to 0.120" |
| Line & Spaces: | 0.003" / 0.003" Inner Layers; 0.004" Outer Layers |
| Hole Size: | 0.006" Thru Hole (Finished Size) and 0.004" Buried Via, |
| Materials: | FR4, High Tg, Rogers, Halogen-free material, Teflon, Polyimide |
| Surface Finishes: | ENi/IAu, OSP, Immersion Silver, Immersion Tin |
| Special Products: | Blind/ Buried Via(HDI 2+N+2), Rigid Flex |
With the rapid development of information and communication technologies, electronic devices like smartphones, wireless routers, base stations and other communication equipment have become indispensable in daily life and work. The printed circuit boards in these devices serve as the foundation for assembly of components and integrated circuits, enabling the transmission of high-speed signals and data that make communication possible.
PCBs for Communication Equipment
Communication device PCBs facilitate interconnections between active and passive components using conductive copper traces etched from copper-clad laminate boards. They provide mechanical support and the necessary electrical connections dictated by the intended functioning of the device. But most importantly, PCBs designed for communications applications must transmit signals accurately and reliably between components, without unacceptable loss or interference. This requires specialized materials and fabrication processes to serve the unique demands of high-frequency communication electronics.
At JHYPCB, we have rich expertise in manufacturing PCBs for all kinds of communication devices, from consumer electronics to telecom infrastructure. Leveraging over a decade of experience serving major brands globally, we fully understand the stringent requirements and can reliably produce communication PCBs for the most demanding applications. Whether prototyping bleeding-edge designs or volume production of complex boards, we have the capabilities to deliver.
Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.
Service Offerings:
Innovative Rigid-Flex Processes
Premium Material Sets
Rigid-Flex with HDI
Loose Leaf Construction
Oversized Panels
Layer counts to 40+
Heat Sink Application
